S-MODUL showcased its SMP™ Series, a high-density fiber connectivity solution for next-generation data centers, at Photonics Korea 2025 held on October 30–31 in Gwangju, Korea. Designed for 400G/800G environments, the SMP™ Series offers seamless integration with 19-inch racks, supports up to 144 fibers in 1U, and features a one-hand Push-Lock & Release system for faster, safer maintenance. We also had insightful meetings with buyers from Thailand and India, exploring opportunities to expand S-MODUL’s presence in the global data center market.
S-MODUL showcased its SMP™ Series, a high-density fiber connectivity solution for next-generation data centers, at Photonics Korea 2025 held on October 30–31 in Gwangju, Korea.
Designed for 400G/800G environments, the SMP™ Series offers seamless integration with 19-inch racks, supports up to 144 fibers in 1U, and features a one-hand Push-Lock & Release system for faster, safer maintenance.
We also had insightful meetings with buyers from Thailand and India, exploring opportunities to expand S-MODUL’s presence in the global data center market.